PRINTED CIRCUIT BOARD - TECHNICAL INFORMATION

Manufacturing technologies

 

  • Single sided (npth + pth)
  • Double sided PCBs
  • Multi layer up to 32 layer
  • Flex and rigid Flex
  • Copper structure up to 80 µm
  • Thick copper technology up to 400 µm
  • Microvias, blind Via, buried Via,
    Via Plugging, filled Via
  • Max. format for serial production
    1200 x 670 mm
  • PTH outline

 

 

 

  • Hot air leveling (HAL)
  • Hot air leveling leadfree (HAL-LF)
  • Lead-free, leaded
  • Lead-free hot air leveling
  • OSP
  • Entek
  • Galvanic gold-plating
    (5 µm Ni, 1-2 µm Au)
  • Chemical gold-plating (ENIG)
  • Chemical nickel palladium gold (ENEPIG)
  • Chemical tin

 

 

Solder mask coating:

 

  • Photosensitive coating, green
    Screen-printing, 2-components UV, green
  • Screen-printing, photosensitive white, green, yellow, blue, red, black and grey

 

Contour:

 

  • Routing
  • Deep Routing (npth + pth)
  • Counter sunk (npth + pth)
  • V-cut
  • Punching

 

Basic material:

 

  • FR4, Isola (Duraver, IS400)
  • Fr4, Panasonic
    (R 1755-11, R 1566-W halogenfree)
  • FR4, ITEQ (IT-180)
  • High TG: P96, P97, VT-901
  • Teflon
  • Rogers 
  • Polyimide
  • Aluminum core

 

 

Special Print:

 

  • Legend print, white, lemon yellow, black
    (other colors on request)
  • Carbon print
  • peelable mask, blue or white

 

Formats and Tolerances

 

  • Max. PCB size:
    - single-/double sides 1500 mm x 670 mm
    - multi layer 1200 mm x 670 mm
  • Min. track width and dielectric
    spacing 0,08 mm
  • Min. drill diameter 0,1 mm
  • Aspect Ratio 1:10
  • Production guidelines:
    PERFAG and IPC-A-600G
News
quality requirements according to „IPC-A-600
Class 3“
read more